Platinum Electrodes and Structured Substrates for Electronic
Platinum Electrodes and Structured Substrates for Electronic thin films are widely used botton electrode for Si-based electronic devices because of its high thermal conductivity & good stability in oxidizing atmospheres. The Pt wafers have thermal stability, which guarantees excellent performance of electronic devices including MEMS.
Platinized Si Wafers
- Pt film thickness : 50 nm ~ 300 nm
- Adhesion layer : Ti, 10 nm ~ 20 nm
- Substrates : SiO2 /Si wafers, SiO2 /SOI wafers
- Size : Sample size ~ 6 inches
- Orientation : (111)
- FWHM : ~ 2° (depends on substrate)
- Temperature endurance : ~ 800°C
- Roughness (Rms) : ~ 1.5 nm
Metal Coating Services
- Pt, Au, AL, Ti, Mo, Ta, Cr, Cu, Ni, NiCr etc.
- Substrate & Film thickness : As per customer requirements
Structured Substrates for piezo-MEMS Devices
- Pt/Ti/SOI Wafer
- Pt/Ti/LTO/Si3N4 /(SiO2)/Si Wafer
- Others
Products ( 6 inch Standard) | Quantity |
1. Platinized Si wafer (6 inch, Standard) – Orientation of Pt: (111) – Thickness of Pt: 150 nm – Adhesion layer: Ti, 10~20 nm * Substrate: SiO2/Si – SiO2: (dry) thermal oxide, 300 nm – Si: 6 inch, p-type, Prime, SSP, <100> * Film structure: Pt/Ti/SiO2/Si | 1 |
2. Platinized Si wafer (4 inch) | 1 |
3. Pt coating (user wafer) | 1 |
4. 4 inch Pt coating (user wafer) | 1 |
5. Top Pt electrode (150 nm) | 1 |
Futher Inquiry Email us at info@allindiametal.com or call us at +91 22 4970 0739
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Our Advantages For The Most Part …… Platinum Electrodes and Structured Substrates for Electronic
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